It is our great pleasure to invite you to the 2026 5th International Symposium on Semiconductor and Electronic Technology (ISSET 2026) to be held in Xi'an, China, July 24-26, 2025. ISSET 2026 will provide a forum within the international academic and engineering community in the field of Semiconductor and Electronic Technology.
At the forefront of the global STI mega-trend, China has been creating an increasingly open STI environment, increasing the depth and breadth of academic collaboration, and building a community of innovation that benefits all. These efforts make a new contribution to globalization and the creation of a common community for the future.
The annual ISSET conference aims to gather professors, researchers, scholars, and industrial pioneers from all over the world. ISSET is the premier forum for the presentation and exchange of past experiences, new advances, and research results in the field of theory and industrial applications. The conference welcomes contributions that promote the exchange of ideas and discourse between educators and researchers worldwide. The organizing committee is pleased to invite prospective authors to submit their original manuscripts to ISSET 2026.
We warmly invite you to participate in ISSET 2026 and look forward to seeing you in Xi'an, China!
Full Paper Submission Date
May 5, 2026
Notification of acceptance date
June 1, 2026
Final Paper Submission Date
June 20, 2026
Conference Dates
July 24-26, 2026
☛ CFP
☛ Submission
☛ Publication
☛ Other
The topics of interest for submission include, but are not limited to:
· Materials Science
· Semiconductor Spin Physics and Topological Phenomena
· Semiconductor Nano and Devices
· Wide/Narrow Bandgap Semiconductors
· Compound Semiconductors
· Magnetic Semiconductors
· Organic Semiconductors
· Advanced Photoresists
· Optoelectronic and Photovoltaic Devices
· Semiconductor Physics
· Semiconductor Quantum Computing
· Semiconductor Materials and Device Reliability
· Semiconductor Manufacturing and Applications
· Emerging Semiconductor Technologies
· 3D Semiconductor Device Technology
· Sensors
· Fully Integrated Automation
· Automated Inspection
· …
· Fiber Optics
· Electronic Information Engineering
· Information Security
· Electronic Information Technology
· Circuit Analysis and Design
· Electronic Packaging Technology
· Microelectronics Science and Engineering
· Electronics and Nanoelectronics
· Advanced Electromagnetics
· Communication Electronic Circuits
· Integrated Circuit Design and Integrated Systems
· Microwave Photonic Device Physics
· Integrated Optics
· Micro/Nano Systems and Networks
· Digital Signal Processing
· Analog Computing
· Information Processing Technology
· …
1. The submitted papers must not be under consideration elsewhere.
2. Please send the full paper(word+pdf) to Submission System.
3. Please submit the full paper, if presentation and publication are both needed.
4. Please submit the abstract only, if you just want to make presentations.
5. Templates Download.
6. Should you have any questions, or you need any materials in English, please contact us.
All papaers, both invited and contributed, will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted papers will be published in the conference Proceedings, and it will be submitted to EI Compendex and Scopus for indexing.
Cover
Ei Compendex
Scopus
Cover
Ei Compendex
Scopus
Cover
Ei Compendex
Scopus
Note: All submitted articles should report original research results, experimental or theoretical, not previously published or under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of any academics. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.