2023 2nd International Symposium on Semiconductor and Electronic Technology(ISSET 2023)

A.Prof. Liu Chu from Nantong University, China was invited as the TPC!


A.Prof. Liu Chu, Nantong University , China

Liu Chu received the B.S. degree in material science and engineering and the M.S. degree in mechanics from Dalian Maritime University, Dalian, China, in 2010 and 2012, respectively, and the Ph.D. degree in mechanics from the Institut national des sciences appliquées de Rouen (INSA Rouen), Saint-Étienne-du-Rouvray, France, in January 2017. She is currently an Associate Professor with the School of Transportation and Civil Engineering, Nantong University, Nantong, China, with the cooperation and communication with Nantong Fujitsu Microelectronics Company, Nantong. Her main research interests include electronic packaging reliability and optimization, nanomaterial computational mechanics, stochastic, and uncertainty quantification mathematics.

储柳,女,博士,硕士生导师,本科与硕士毕业于大连海事大学,博士毕业于法国鲁昂国家应用科学学院(INSA Rouen)。现任南通大学交通与土木工程学院副教授,与南通富士通微电子公司合作交流。主要研究方向包括电子封装可靠性与优化、纳米材料计算力学、随机和不确定性量化数学。在IEEE Transactions on Components, Packaging and Manufacturing Technology, Journal of Electronic Materials等期刊以第一作者/通信作者发表SCI期刊论文20余篇。主持国家自然科学基金1项,江苏省自然科学基金1项,江苏省高校自然科学基金1项,参与国家级与省部级项目多项。